CBM Process: an alternative for chromic acid etching in plating of plastics


Summary

The Cuptronic CBM Process is a new and better adhesion promotion method to prepare plastic parts for metallization. It completely replaces chromic acid etching, making the process safe and environmentally friendly, while also allowing a broader choice of plastics.


Description

The common process for chrome plating of plastics includes a preparation step, where the surface is treated to make it possible for an initial conductive layer to be applied. This step normally involves chromic acid etching, which means usage of CrVI. The Cuptronic CBM (Covalent Bonded Metallization) Process eliminates the need for chromic acid etching and thus enables a complete replacement of CrVI in electroplating. Instead of etching cavities in the surface, the CBM process chemically creates customized polymers, which grafts from the substrate surface. These polymer structures create the texture to which the metal layer can adhere to. In practice, it is a three-step process, as depicted in the illustrations shown below. For more info, please refer to the downloadable info package.


Possible replacement to

Chromium VI


Cuptronic Technology AB
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Cuptronic Technology AB
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Peter Sjobeck

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Documents:
Cuptronic information package.pdf

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